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Bond strength and interfacial structure of silicon nitride joints brazed with aluminium-silicon and aluminium-magnesium alloys

Ning, X. ; Okamoto, T. ; Miyamoto, Y. ; Koreeda, A. ; Suganuma, K. ; Goda, S.

Journal of Materials Science, 1991, Vol.26(8), pp.2050-2056 [Tạp chí có phản biện]

ISSN: 0022-2461 ; E-ISSN: 1573-4803 ; DOI: 10.1007/BF00549166

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  • Nhan đề:
    Bond strength and interfacial structure of silicon nitride joints brazed with aluminium-silicon and aluminium-magnesium alloys
  • Tác giả: Ning, X. ; Okamoto, T. ; Miyamoto, Y. ; Koreeda, A. ; Suganuma, K. ; Goda, S.
  • Chủ đề: Silicon Nitride ; Brazing ; Brazed Joints ; Mechanical Properties ; Interfaces ; Microstructure ; Bend Strength ; Bonding Strength ; Weibull Modulus ; Filler Metal ; Joining (EC)
  • Là 1 phần của: Journal of Materials Science, 1991, Vol.26(8), pp.2050-2056
  • Mô tả: From the results of the bending strength and Weibull modulus of the joints of silicon nitride ceramics brazed using aluminium-silicon and aluminium-magnesium alloy filler metals at a temperature of 1073 K for 0.9 ksec in a vacuum of 1.3 × 10 −3 Pa, silicon, especially, present in a small amount in the filler metals, was found to be effective in improving the bond strength, while magnesium in the filler metals was harmful to the joining. This can result in the formation of a thick stable alumina layer on the surfaces of the filler metals containing magnesium during brazing which prevented contact of the filler metals with the silicon nitride ceramics.
  • Ngôn ngữ: English
  • Số nhận dạng: ISSN: 0022-2461 ; E-ISSN: 1573-4803 ; DOI: 10.1007/BF00549166

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